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Bond Connect Anniversary Summit 2024

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Event Details

Date
9 July 2024 (Tuesday)
Time
Hong Kong (GMT +8) 9:00am – 5:30pm
Location
HKEX Connect Hall, 1/F, One and Two Exchange Square, 8 Connaught Place, Central
Remarks

Format: Hybrid (In-person or online)


Language: English and Putonghua (Simultaneous interpretation available)

Overview

In the seven years since the launch of Bond Connect, continuous innovations, expansions and new initiatives, such as Swap Connect, have deepened market connectivity between the Mainland and Hong Kong and propelled the opening up of China’s financial markets.

Themed “Innovating and Partnering for the Future”, Bond Connect Anniversary Summit 2024 will take place on Tuesday, 9 July 2024 to celebrate the many milestones of the past year, where regulators, issuers, investors, and market participants from Mainland China and Hong Kong will share valuable insights covering the global macroeconomy, cross-border green and sustainable finance, China financial markets opening-up and China bond investment opportunities.

For details, please check here.

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