As outlined in the Hong Kong Innovation and Technology Development Blueprint, “The semiconductor chip industry is currently one of our country’s priority directions of industry development.” To realize such a vision, a public industry event will be hosted at the Hong Kong Science Park as part of our ongoing efforts to promote the development of the semiconductor chip industry.
On 27th June, “Tomorrow Microelectronics: From Analog Design to IC Fabrication cum Kick-off Ceremony of IDM2 Level Up 2 Program” will be hosted in the Hong Kong Science Park. This event will be co-organized by Hong Kong Science and Technology Park (HKSTP), Invest Hong Kong, the Hong Kong Electronic Industries Association (HKEIA), and GIDMA (the exclusive strategic partner for Forb¬es Global Alliance in China).
This turn-key event is specifically tailored for microelectronics professionals and hardware equipment developers. Esteemed industry leaders from HKSTP’s co-incubation partners will deliver insightful keynote speeches. Topics including: “Global Semiconductor IP Market Trend: The Opportunities & Importance”, “From Innovation to Manufacturing: The Successful Path to Commercialization”, and “3rd Generation Semiconductor: From Design to Fabrication”, and more.
The event will also feature a diverse range of technology showcases, encompassing microelectronics, hardware equipment manufacturers, electrical packaging, and new materials, etc.
