Bond Connect Anniversary Summit will take place on Tuesday, 4 July 2023 to celebrate the achievements of this pioneering platform and explore the latest developments shaping Bond Connect and China’s financial markets.
Themed "Integrity, Innovation and Connectivity", the event will bring together government representatives, regulators, issuers, investors and market participants from across Mainland China and Hong Kong to take a closer look at the new opportunities emerging for RMB internationalisation, the latest updates on the Connect schemes and the trends shaping cross-border investment and financing.
