Tender / Quotation Notices

Invitation for Expression of Interest (EOI) for Hong Kong FinTech Week 2024-2026 Event Sponsorship

Fintech Tender 9 Jan 2024

InvestHK is now inviting qualified companies to submit an Expression of Interest (EOI) for Hong Kong FinTech Week 2024-2026 Event Sponsorship. Organised by the Financial Services and the Treasury Bureau (FSTB) and Invest Hong Kong, Hong Kong FinTech Week will run in every October / November for 2024 to 2026. For more details, please refer to the attached PDF.

Deadline for EOI submission: on or before 4 pm HKT, 23 January 2024.

POSTED ON: 9th January 2024

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